I'd like to think that a lot has been learned over the last few years about how to design a switch which is optimised for audio, and that any switch designed in 2025 will be holistically designed ie. that the designer will maximise sonic performance with a combination of effective circuitry and an effective enclosure/case, and this will include heat dissipation as required.
A few years ago, a case was just seen as a receptacle for the circuitry but the role of the case (in shielding from radiated RFI, for example) as an integral part of a holistic design is now widely recognised as of far more importance than mere aesthetics. So for example, a switch case will usually be made from a material which is a good conductor (and therefore a good shield) like aluminium or copper, rather than from steel which is not. It is more likely than not that heat dissipation will be through effective coupling of any hot-running components to the case, with integrated heatsinks if required, rather than through ventilation holes which allow radiated RFI to enter; and of course aluminium and copper are excellent for heat dissipation too. The proof of the pudding is always in the eating, but I'd be genuinely surprised if heat dissipation was a concern in any modern switch! Hope this reassures.
A few years ago, a case was just seen as a receptacle for the circuitry but the role of the case (in shielding from radiated RFI, for example) as an integral part of a holistic design is now widely recognised as of far more importance than mere aesthetics. So for example, a switch case will usually be made from a material which is a good conductor (and therefore a good shield) like aluminium or copper, rather than from steel which is not. It is more likely than not that heat dissipation will be through effective coupling of any hot-running components to the case, with integrated heatsinks if required, rather than through ventilation holes which allow radiated RFI to enter; and of course aluminium and copper are excellent for heat dissipation too. The proof of the pudding is always in the eating, but I'd be genuinely surprised if heat dissipation was a concern in any modern switch! Hope this reassures.
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